The CHAMP-AV9 SBC from Curtiss Wright combines the floating point performance of the latest Intel Core i7 processors, with the substantial bandwidth and system-enabling features of the 6U OpenVPX form-factor. The CHAMP-AV9 SBC offers a 2-4X performance per size, weight and power improvement over previous DSP modules. A dual-channel 25 GB/s (each) DDR3 memory per CPU provides ample bandwidth to simultaneously serve CPU access and streaming I/O from the VPX backplane interfaces. The CHAMP-AV9 SBC specifically has been upgraded to DDR 1600 and rugged implementations will incorporate thermal management solutions that minimize throttling at Curtiss-Wright’s benchmark L100 and L200 environments.
The CHAMP-AV9 is the DSP multi-processing component of Curtiss-Wright Defense Solutions’ High-Performance Embedded Computing (HPEC) solution set that also includes FPGA modules, GPGPU’s, FMC and XMC IO, Fabric switching, Single Board Computers, backplanes and enclosure packaging.
To know more, visit http://www.cwcdefense.com/products/dsp-fpga/intel-dsp/champ-av9.html