The CHAMP-AV9 SBC from Curtiss Wright combines the floating point performance of the latest Intel Core i7 processors, with the substantial bandwidth and system-enabling features of the 6U OpenVPX form-factor. The CHAMP-AV9 SBC offers a 2-4X performance per size, weight and power improvement over previous DSP modules.   A dual-channel 25 GB/s (each) DDR3 memory per CPU provides ample bandwidth to simultaneously serve CPU access and streaming I/O from the VPX backplane interfaces. The CHAMP-AV9 SBC specifically has been upgraded to DDR 1600 and rugged implementations will incorporate thermal management solutions that minimize throttling at Curtiss-Wright’s benchmark L100 and L200 environments.

The CHAMP-AV9 is the DSP multi-processing component of Curtiss-Wright Defense Solutions’ High-Performance Embedded Computing (HPEC) solution set that also includes FPGA modules, GPGPU’s, FMC and XMC IO, Fabric switching, Single Board Computers, backplanes and enclosure packaging.

To know more, visit

Technical Specifications
  • Two Intel Core-i7 quad-core 4th generation processors
  • 16 GB DDR3 SDRAM with ECC
  • Four 40 Gb Ethernet Data Plane interfaces at an aggregate 112 Gbps
  • Seamless integration into HPEC systems including FPGA’s, GPGPU’s, Sensor I/O and Middleware
  • Two 16-lane Gen3 PCI Express Expansion Plane interfaces
  • Additional I/O: (2) Gigabit Ethernet, (1) AC97 Stereo Audio port, (2) EIA-232, (2) EIA-422, (4) GPIO, (3) USB, (3) Serial ATA (SATA)
  • Backplane Fabric: (2) 4x PCI Express (PCIe) Gen 2
  • Rugged air-cooled and conduction-cooled versions
  • VxWorks BSP and Linux LSP

Ask a Question





2018-01-19 19:01:55