CHAMP-AV9

CHAMP-AV8

The CHAMP-AV9 SBC from Curtiss Wright combines the floating point performance of the latest Intel Core i7 processors, with the substantial bandwidth and system-enabling features of the 6U OpenVPX form-factor. The CHAMP-AV9 SBC offers a 2-4X performance per size, weight and power improvement over previous DSP modules.   A dual-channel 25 GB/s (each) DDR3 memory per CPU provides ample bandwidth to simultaneously serve CPU access and streaming I/O from the VPX backplane interfaces. The CHAMP-AV9 SBC specifically has been upgraded to DDR 1600 and rugged implementations will incorporate thermal management solutions that minimize throttling at Curtiss-Wright’s benchmark L100 and L200 environments.

The CHAMP-AV9 is the DSP multi-processing component of Curtiss-Wright Defense Solutions’ High-Performance Embedded Computing (HPEC) solution set that also includes FPGA modules, GPGPU’s, FMC and XMC IO, Fabric switching, Single Board Computers, backplanes and enclosure packaging.

To know more, visit http://www.cwcdefense.com/products/dsp-fpga/intel-dsp/champ-av9.html

Technical Specifications
  • Two Intel Core-i7 quad-core 4th generation processors
  • 16 GB DDR3 SDRAM with ECC
  • Four 40 Gb Ethernet Data Plane interfaces at an aggregate 112 Gbps
  • Seamless integration into HPEC systems including FPGA’s, GPGPU’s, Sensor I/O and Middleware
  • Two 16-lane Gen3 PCI Express Expansion Plane interfaces
  • Additional I/O: (2) Gigabit Ethernet, (1) AC97 Stereo Audio port, (2) EIA-232, (2) EIA-422, (4) GPIO, (3) USB, (3) Serial ATA (SATA)
  • Backplane Fabric: (2) 4x PCI Express (PCIe) Gen 2
  • Rugged air-cooled and conduction-cooled versions
  • VxWorks BSP and Linux LSP

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Defense

2018-01-19 19:01:55